Title:
FINE-GRAIN BANDING-FREE FIREPROOF METAL SPUTTERING TARGET WITH UNIFORMLY RANDOM CRYSTAL ORIENTATION, METHOD OF MANUFACTURING SUCH FILM, AND THIN FILM-BASED DEVICE AND PRODUCT MANUFACTURED THEREFROM
Document Type and Number:
Japanese Patent JP2014129599
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a technique for manufacture in the form of a desired microstructure directly on a used backing plate regardless of pre-removal from the backing plate while the technique can be used to reproduce or repair a sputtering target.SOLUTION: There is provided a process of manufacturing a sputtering target assembly in an additional configuration, the process including a step of vapor-depositing a target powder material directly on a backing plate or backing tube through powder spray. The target has a fine and uniform isometric grain structure of less than 44 microns, is substantially free of any inter-particle diffusion when measured through electron back-scattering diffraction (EBSD) and free of selected texture orientation, and does not show banding of a particle size or texture through the whole target body.
More Like This:
Inventors:
MILLER STEVEN A
KUMAR PRABHAT
WU RICHARD
SUN SHUWEI
ZIMMERMANN STEFAN
SCHMIDT-PARK OLAF
KUMAR PRABHAT
WU RICHARD
SUN SHUWEI
ZIMMERMANN STEFAN
SCHMIDT-PARK OLAF
Application Number:
JP2013266839A
Publication Date:
July 10, 2014
Filing Date:
December 25, 2013
Export Citation:
Assignee:
HC STARCK INC
HC STARCK GMBH
HC STARCK GMBH
International Classes:
C23C14/34; B22F3/24; C22C1/02; C22C1/04; C22C9/00; C22C14/00; C22C16/00; C22C27/02; C22C27/04; C22C30/00; C23C24/04; B22F1/052
Domestic Patent References:
| JP2008540823A | 2008-11-20 | |||
| JPH11269639A | 1999-10-05 | |||
| JPH11256323A | 1999-09-21 | |||
| JP2004523653A | 2004-08-05 | |||
| JPH06158300A | 1994-06-07 | |||
| JPH06346232A | 1994-12-20 | |||
| JPH04323366A | 1992-11-12 |
Attorney, Agent or Firm:
Hidesaku Yamamoto
Natsuki Morishita
Natsuki Morishita