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Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2014138080
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device in which a heat sink is capable of being pressed against and secured to a support substrate in a structure having a collar which is subject to an axial force generated by fastening of a bolt.SOLUTION: A semiconductor device comprises a collar 9. The collar includes a small diameter part 13, a large diameter part 14, and a diaphragm part 15. The large diameter part 14 is cylindrical in shape which is hollow and extends in a vertical direction and has a film thickness t and is formed to have a large diameter part external diameter φL and provided on a heat spreader 6 via an insulator 12. The small diameter part 13 is located above the large diameter part 14 and is cylindrical in shape which is hollow and extends in a vertical direction and is formed to have a small diameter part external diameter φS(φS<φL). the diaphragm part 15 connects an upper limit of the large diameter part 14 and a lower limit of the small diameter part 13 and has a film thickness t and extends in a horizontal direction and is formed to have an annular shape in planar view and function as a connection part between the small diameter part 13 and the large diameter part 14.

Inventors:
IMOTO YUJI
Application Number:
JP2013005945A
Publication Date:
July 28, 2014
Filing Date:
January 17, 2013
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L23/40; F16B5/02; F16B39/24; F16B43/00
Domestic Patent References:
JP2007305643A2007-11-22
JPH0722106U1995-04-21
JPH11101218A1999-04-13
JPH0178033U1989-05-25
JP2006140317A2006-06-01
JPH09129823A1997-05-16
JP2004165406A2004-06-10
JPS5693349A1981-07-28
JP2010067924A2010-03-25
Attorney, Agent or Firm:
Yoshitake Hidetoshi
Takahiro Arita