Title:
SLIT BLADE FOR FORMING PRESSING GROOVE AND MANUFACTURING METHOD FOR CERAMIC PACKAGE
Document Type and Number:
Japanese Patent JP2014172100
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a slit blade for forming a pressing groove and a manufacturing method for a ceramic package capable of manufacturing a ceramic package having an excellent splittability of a split groove, having no gouging and occurrence of a protrusion on a parting plane, and having high airtight reliability.SOLUTION: A slit blade 10 for forming a pressing groove forms a pressing groove 34 on an unbaked aggregate 32 in order to provide a split groove 24 used for eliminating dummy parts 23 from an aggregate substrate 21 having an aggregate 22, in which multiple ceramic packages 20 providing a concavity 25 for accommodating an electronic part element are arranged, and the dummy parts 23 on an outer circumference thereof, and used for separating the dummy parts 23 as a piece body. The slit blade 10 for forming a pressing groove includes: a cutting blade 11 having blade width entirely making depth of a pressing groove and having a shape of kinked line with bilateral symmetry to a center line of board thickness in a sectional view; and a pressing force part 13 being capable of pressing around the pressing groove 34 and including a pressing force surface horizontally extended from end edge parts 12 with bilateral symmetry to the center line of the board thickness in the sectional view, respectively.
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Inventors:
ETO KENTARO
Application Number:
JP2013043620A
Publication Date:
September 22, 2014
Filing Date:
March 06, 2013
Export Citation:
Assignee:
NIPPON STEEL & SUMIKIN ELECTRONICS DEVICES INC
International Classes:
B26D1/06; B28B11/14; H01L23/08; H03H3/02
Domestic Patent References:
JP2001179731A | 2001-07-03 | |||
JPH0817961A | 1996-01-19 | |||
JPH08208356A | 1996-08-13 | |||
JP2011235548A | 2011-11-24 | |||
JP2000141344A | 2000-05-23 | |||
JP2000263535A | 2000-09-26 |