Login| Sign Up| Help| Contact|

Patent Searching and Data


Document Type and Number:
Japanese Patent JP2014172170
Kind Code:
A5
More Like This:
JP2002093757POLISHING PAD AND ITS PRODUCING METHOD AND METHOD FOR POLISHING SEMICONDUCTOR SUBSTRATE
JP6685805Abrasive pad
WO/2023/201189POLYCATIONIC POLYMER OR COPOLYMER HAVING DIFFERENT CATION TYPES FOR SLURRIES IN CHEMICAL MECHANICAL PLANARIZATION
Application Number:
JP2014043782
Publication Date:
March 30, 2017
Filing Date:
March 06, 2014
Export Citation:
Click for automatic bibliography generation   Help
International Classes:
B24B37/24; B24B37/22; B24B37/013; H01L21/304; C08F32/00



 
Previous Patent: JP2014172169

Next Patent: VERTICAL MACHINING CENTER OF GANTRY STRUCTURE WITH MACHINE-INTEGRATED TOOL MAGAZINE STORE