Title:
CARRIER-PROVIDED COPPER FOIL, METHOD OF PRODUCING CARRIER-PROVIDED COPPER FOIL, PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, COPPER-CLAD LAMINATE AND METHOD OF PRODUCING PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2014173094
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide carrier-provided copper foil which has good etching properties of an ultrathin copper layer.SOLUTION: An intermediate layer of carrier-provided copper foil contains Ni. When an insulated substrate is adhered to an ultrathin copper layer in the atmosphere in conditions of a pressure of 20 kgf/cmand a duration of 220°C×2 h and the carrier is peeled by the method of JIS C 6471, the average value of adhesion amounts of Ni in the surface of the ultrathin copper layer on the intermediate layer side is 400 μg/dmor smaller, in the 10-point measurements of the adhesion amounts of Ni in the surface of the ultrathin copper layer on the intermediate layer side at 20-mm intervals in the width direction and in the longitudinal direction. With the standard deviation of the adhesion amounts of Ni of the ultrathin copper layer on the intermediate layer side as σ and the variation coefficient of the Ni adhesion amount as X=σ×100/A, X is 30.0% or lower.
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Inventors:
HONDA MISATO
NAGAURA YUTA
NAGAURA YUTA
Application Number:
JP2013043573A
Publication Date:
September 22, 2014
Filing Date:
March 05, 2013
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP
International Classes:
C25D1/04; B32B15/08; C25D5/12; C25D7/06; H05K1/09; H05K3/06
Domestic Patent References:
JP2005048277A | 2005-02-24 | |||
JP2014193592A | 2014-10-09 | |||
JP3690962B2 | 2005-08-31 | |||
JP2006022406A | 2006-01-26 | |||
JP2005288856A | 2005-10-20 | |||
JP2010222657A | 2010-10-07 | |||
JP2014172179A | 2014-09-22 | |||
JP2014172181A | 2014-09-22 | |||
JP2014193591A | 2014-10-09 |
Foreign References:
WO2014080958A1 | 2014-05-30 |
Attorney, Agent or Firm:
Axis international patent business corporation
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