Title:
MANUFACTURING METHOD OF METAL COMPONENT, AND CASTING MOLD AND RELEASE FILM USED FOR THE SAME
Document Type and Number:
Japanese Patent JP2014189872
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To make it possible to release a metal component from a mold more easily in manufacturing a metal component.SOLUTION: A release film 16 containing a compound expressed by X-L-Si-(O-R)is formed on an uneven pattern surface of a casting mold main body 20, catalyst for electroless plating is applied to the release film 16, a conductive film 14 for electroforming is formed on the release film 16 by electroless plating using the catalyst, a metal material 12 is deposited on the conductive film 14 by electroforming using the conductive film 14, and the deposited metal material 12 is peeled off from the casting mold main body 20. X denotes a group including an aromatic ring, L denotes a linking group with carbon number 1 to 10 which contains at least one of sulfur atom, oxygen atom and nitrogen atom, and R denotes hydrogen atom or an alkyl group with carbon number 1 to 4.
Inventors:
MOROOKA ATSUSHI
Application Number:
JP2013068361A
Publication Date:
October 06, 2014
Filing Date:
March 28, 2013
Export Citation:
Assignee:
FUJIFILM CORP
International Classes:
C25D1/22; C25D1/10
Domestic Patent References:
| JP2005120392A | 2005-05-12 | |||
| JP2012066447A | 2012-04-05 | |||
| JP2012071516A | 2012-04-12 | |||
| JP2010046907A | 2010-03-04 | |||
| JP2007246949A | 2007-09-27 |
Foreign References:
| WO2006070857A1 | 2006-07-06 |
Attorney, Agent or Firm:
Seiji Yanagida
Sakuma 剛
Sakuma 剛