Title:
プリント回路基板用の接地構造
Document Type and Number:
Japanese Patent JP2014504798
Kind Code:
A
Abstract:
The present invention provides a grounding structure for a printed circuit board which is fixed onto a chassis by a force applied at a first side of the printed circuit board towards the chassis. The grounding structure comprises a first grounding pad formed on the bottom surface of the printed circuit board at said first side of the printed circuit board applied with said force; a second grounding pad formed on the top surface of the printed circuit board at a second side opposite to said first side of the printed circuit board; a first grounding point formed on the chassis in a form to be in contact with said first grounding pad from the bottom of the printed circuit board when the printed circuit board is fixed onto the chassis; a second grounding point formed on the chassis in a form to be in contact with said second grounding pad from the top of the printed circuit board when the printed circuit board is fixed onto the chassis; and a supporting point formed on the chassis at a position between the first and the second grounding points for supporting the printed circuit board fixed onto the chassis and for converting said force exerted at said first side of the printed circuit board into another force with opposite direction at said second side of the printed circuit board.
Inventors:
Kiu Chian
Riu, Hong Tao
Ji Yang
Riu, Hong Tao
Ji Yang
Application Number:
JP2013546545A
Publication Date:
February 24, 2014
Filing Date:
December 31, 2010
Export Citation:
Assignee:
Thomson Licensing
International Classes:
H05K7/14
Domestic Patent References:
| JP2010251644A | 2010-11-04 | |||
| JPH11145649A | 1999-05-28 | |||
| JPH0541592A | 1993-02-19 | |||
| JP2009295738A | 2009-12-17 |
Foreign References:
| US5398156A | 1995-03-14 |
Attorney, Agent or Firm:
Riki Kikoshi
Takashi Ishii
Kuramochi Makoto
Suita Reiko
Takashi Ishii
Kuramochi Makoto
Suita Reiko