Title:
最適な材料組成を有する多結晶ダイヤモンド構造体
Document Type and Number:
Japanese Patent JP2014505162
Kind Code:
A
Abstract:
Diamond bonded constructions include a diamond body comprising intercrystalline bonded diamond and interstitial regions. The body has a working surface and an interface surface, and may be joined to a metallic substrate. The body has a gradient diamond volume content greater about 1.5 percent, wherein the diamond content at the interface surface is less than 94 percent, and increases moving toward the working surface. The body may include a region that is substantially free of a catalyst material otherwise disposed within the body and present in a gradient amount. An additional material may be included within the body and be present in a changing amount. The body may be formed by high-pressure HPHT processing, e.g., from 6,200 MPa to 10,000 MPa, to produce a sintered body having a characteristic diamond volume fraction v. average grain size relationship distinguishable from that of diamond bonded constructions form by conventional-pressure HPHT processing.
Inventors:
Bellup, Jay., Daniel
Voronin, George
Yu, Feng
Caliber, peter
Voronin, George
Yu, Feng
Caliber, peter
Application Number:
JP2013541047A
Publication Date:
February 27, 2014
Filing Date:
November 23, 2011
Export Citation:
Assignee:
Smith International, Inc.
International Classes:
C22C26/00; B22F7/00; B25D17/02; E21B10/46
Domestic Patent References:
| JP2010516488A | 2010-05-20 | |||
| JPS57175775A | 1982-10-28 | |||
| JPS6241778A | 1987-02-23 | |||
| JPH0437650A | 1992-02-07 |
Foreign References:
| WO2008092093A2 | 2008-07-31 | |||
| US20080178535A1 | 2008-07-31 | |||
| US4604106A | 1986-08-05 |
Attorney, Agent or Firm:
Isshiki International Patent Service Corporation