Title:
ワイヤ状ナノスケール物体を含む構造体を切断するためのデバイス及び方法
Document Type and Number:
Japanese Patent JP2014506191
Kind Code:
A
Abstract:
A device for cutting a structure including nanotubes, including: a mechanism to polarize linearly laser pulses emitted in a direction of the structure, wherein a duration of the laser pulses is roughly between 1 femtosecond and 300 femtoseconds; and a mechanism to focus the linearly polarized laser pulses on the structure.
Inventors:
Pascal Blanche
Olivier Cheburmontier
Olivier Gobert
Olivier Cheburmontier
Olivier Gobert
Application Number:
JP2013543731A
Publication Date:
March 13, 2014
Filing Date:
December 14, 2011
Export Citation:
Assignee:
INSERM(INSTITUT NATIONAL DE LA SANTE ET DE LA RECHERCHE MEDICALE)
International Classes:
B23K26/12; B23K26/00; B23K26/142; B23K26/38; B23K26/40; B82Y40/00
Foreign References:
| US20080033135A1 | 2008-02-07 | |||
| WO2007012215A1 | 2007-02-01 | |||
| WO2007149109A2 | 2007-12-27 |
Attorney, Agent or Firm:
Yasuhiko Murayama
Masatake Shiga
Takashi Watanabe
Shinya Mitsuhiro
Masatake Shiga
Takashi Watanabe
Shinya Mitsuhiro