Title:
レーザ切断プロセスの制御方法およびこれを行うレーザ切断システム
Document Type and Number:
Japanese Patent JP2014512273
Kind Code:
A
Abstract:
Laser cutting processes are provided which are controlled using as a reference signal one or more emission lines which are characteristic of the radiation emitted by a gas or, more generally, by an emitting element present in the volume irradiated by the laser beam focussed by a laser head and adjusting, on the basis of this reference signal, at least one of the following process control parameters: the power of the laser, the frequency and the duty cycle of the laser pulse, the pressure of an assisting gas emitted by a nozzle forming part of the laser head, the relative speed of the laser head with respect to the workpiece, the distance between the laser head and the surface of the workpiece, and the distance between the focal point of the laser beam and the surface of the workpiece. Laser cutting devices are also provided.
Inventors:
Maurizio Subetti
Stefano Bertorudi
Daniele Colombo
Barbara Previtari
Giovanni Riva
Matteo Dunage
Lorenzo Molinari Tozzatti
Diego Palazzoli
Stefano Bertorudi
Daniele Colombo
Barbara Previtari
Giovanni Riva
Matteo Dunage
Lorenzo Molinari Tozzatti
Diego Palazzoli
Application Number:
JP2014505773A
Publication Date:
May 22, 2014
Filing Date:
April 20, 2012
Export Citation:
Assignee:
Adige Societa Peratini
International Classes:
B23K26/38; B23K26/00; B23K26/14
Domestic Patent References:
| JP2001138082A | 2001-05-22 | |||
| JPS5451097A | 1979-04-21 | |||
| JP2005131645A | 2005-05-26 | |||
| JP2011073014A | 2011-04-14 | |||
| JP2010274278A | 2010-12-09 | |||
| JPH04224092A | 1992-08-13 | |||
| JP2010240689A | 2010-10-28 | |||
| JP2009194176A | 2009-08-27 |
Attorney, Agent or Firm:
Takuji Yamada
Mitsuo Tanaka
Mikio Takeuchi
Mitsuo Tanaka
Mikio Takeuchi