Title:
3次元構造のモノリシック製作
Document Type and Number:
Japanese Patent JP2014512973
Kind Code:
A
Abstract:
A multi-layer, super-planar structure can be formed from distinctly patterned layers. The layers in the structure can include at least one rigid layer and at least one flexible layer; the rigid layer includes a plurality of rigid segments, and the flexible layer can extend between the rigid segments to serve as a joint. The layers are then stacked and bonded at selected locations to form a laminate structure with inter-layer bonds, and the laminate structure is flexed at the flexible layer between rigid segments to produce an expanded three-dimensional structure, wherein the layers are joined at the selected bonding locations and separated at other locations.
Inventors:
Three Saran, Plasive
John Whitney
Wood, robert
John Whitney
Wood, robert
Application Number:
JP2013553600A
Publication Date:
May 29, 2014
Filing Date:
February 10, 2012
Export Citation:
Assignee:
PRESIDENT AND FELLOWS OF HARVARD COLLEGE
International Classes:
B81C3/00; H01L41/09
Domestic Patent References:
| JP2005238337A | 2005-09-08 | |||
| JP2005238337A | 2005-09-08 |
Foreign References:
| US7451596B2 | 2008-11-18 | |||
| US7451596B2 | 2008-11-18 |
Other References:
JPN7016000144; Ｒｏｂｅｒｔ Ｊ． ＷＯＯＤ: 'Ｔｈｅ Ｆｉｒｓｔ Ｔａｋｅｏｆｆ ｏｆ ａ Ｂｉｏｌｏｇｉｃａｌｌｙ Ｉｎｓｐｉｒｅｄ Ａｔ-Ｓｃａｌｅ Ｒｏｂｏｔｉｃ Ｉｎｓｅｃｔ' ＩＥＥＥ ＴＲＡＮＳＡＣＴＩＯＮＳ ＯＮ ＲＯＢＯＴＩＣＳ ＶＯＬ．２４， ＮＯ．２, 200804, ｐ．３４１-３４７, ＩＥＥＥ
JPN7016000144; Ｒｏｂｅｒｔ Ｊ． ＷＯＯＤ: 'Ｔｈｅ Ｆｉｒｓｔ Ｔａｋｅｏｆｆ ｏｆ ａ Ｂｉｏｌｏｇｉｃａｌｌｙ Ｉｎｓｐｉｒｅｄ Ａｔ-Ｓｃａｌｅ Ｒｏｂｏｔｉｃ Ｉｎｓｅｃｔ' ＩＥＥＥ ＴＲＡＮＳＡＣＴＩＯＮＳ ＯＮ ＲＯＢＯＴＩＣＳ ＶＯＬ．２４， ＮＯ．２, 200804, ｐ．３４１-３４７, ＩＥＥＥ
JPN7016000144; Ｒｏｂｅｒｔ Ｊ． ＷＯＯＤ: 'Ｔｈｅ Ｆｉｒｓｔ Ｔａｋｅｏｆｆ ｏｆ ａ Ｂｉｏｌｏｇｉｃａｌｌｙ Ｉｎｓｐｉｒｅｄ Ａｔ-Ｓｃａｌｅ Ｒｏｂｏｔｉｃ Ｉｎｓｅｃｔ' ＩＥＥＥ ＴＲＡＮＳＡＣＴＩＯＮＳ ＯＮ ＲＯＢＯＴＩＣＳ ＶＯＬ．２４， ＮＯ．２, 200804, ｐ．３４１-３４７, ＩＥＥＥ
Attorney, Agent or Firm:
Patent business corporation Kita Aoyama International