Title:
形状部品を備えたプリント回路基板及びその製造方法
Document Type and Number:
Japanese Patent JP2014516208
Kind Code:
A
Abstract:
A printed circuit board and a method for the production thereof. The printed circuit board can include a shaped part made of an electrically conducting material and can be used to manage the currents and heat volumes that occur in the field of power electronics.
Inventors:
Welfel, marcus
Application Number:
JP2014511771A
Publication Date:
July 07, 2014
Filing Date:
May 23, 2012
Export Citation:
Assignee:
Yuma Tech Game Beher
International Classes:
H05K3/20; H01F17/00; H01F17/04; H05K1/02; H05K3/46
Domestic Patent References:
| JP2008004823A | 2008-01-10 | |||
| JPH0548379U | 1993-06-25 | |||
| JP2007158341A | 2007-06-21 |
Attorney, Agent or Firm:
Shoichi Okuyama
Moriaki Ogawa
Haruyuki Nishiyama
Rie Ikemoto
Mitsuji Sekiya
Arihara Koichi
Matsushima Tetsuo
Hidefumi Kawamura
Moriaki Ogawa
Haruyuki Nishiyama
Rie Ikemoto
Mitsuji Sekiya
Arihara Koichi
Matsushima Tetsuo
Hidefumi Kawamura