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Title:
電気的な接続素子を備えているガラス板
Document Type and Number:
Japanese Patent JP2014519149
Kind Code:
A
Abstract:
A pane, includes a substrate, an electrically conductive structure on a region of the substrate, a layer of a solder material on a region of the electrically conductive structure, and at least two soldering points of the at least one electrical connection element on the solder material, wherein the at least two soldering points form at least one contact surface between the at least one electrical connection element and the electrically conductive structure, and a shape of the at least one contact surface has at least one segment of an oval, an ellipse, or a circle with a central angle α of at least 90°.

Inventors:
Halalto coleva
Christoph Degen
Bear heart royale
Mecha ratai chak
Andreas Schrap
Rotorless Meister
Application Number:
JP2014509651A
Publication Date:
August 07, 2014
Filing Date:
April 17, 2012
Export Citation:
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Assignee:
Saint-Gobain Glass France
International Classes:
H01R4/02; H01R4/58; H01R13/03; H01R43/02; H05B3/02
Domestic Patent References:
JP2008218399A2008-09-18
JP2008041518A2008-02-21
JP2001126648A2001-05-11
JPH0696847A1994-04-08
Foreign References:
US0007022A1850-01-15
WO2012149985A12012-11-08
Attorney, Agent or Firm:
Einzel Felix-Reinhard
Takuya Kuno