ＵＶ照射硬化型−レドックス硬化型接着剤系を用いる基材の接着方法 - Henkel KGaA China Company, Limited HENKEL CHINA CO. LTD.

Title:

ＵＶ照射硬化型−レドックス硬化型接着剤系を用いる基材の接着方法

Document Type and Number:

Japanese Patent JP2014527099

Kind Code:

A

Abstract:

The present invention provides a method for bonding two substrates using a UV radiation curing-redox curing adhesive system having a shadow area and a transparent area, comprising: bonding the shadow area of the substrates using a redox curing adhesive system, and bonding the transparent area of the substrates using a liquid optically clear adhesive containing UV initiators.

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Inventors:

シャビールアターワラ
Jo Nicolas
ユアン Jimmie
ルウ Daniel
Son and jon -- ジエン

Application Number:

JP2014521923A

Publication Date:

October 09, 2014

Filing Date:

July 18, 2012

Export Citation:

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Assignee:

Henkel KGaA China Company, Limited HENKEL CHINA CO. LTD.

International Classes:

C09J4/00; B29C65/48; C09J5/00; C09J11/06

Domestic Patent References:

JP2012219180A	2012-11-12
JP2013253117A	2013-12-19
JP2010513573A	2010-04-30
JPH01207371A	1989-08-21
JPH05320584A	1993-12-03
JPS58138763A	1983-08-17
JP2008059945A	2008-03-13
JPS62125913A	1987-06-08

Attorney, Agent or Firm:

Mitsuo Tanaka
Yamasaki 宏
Ken-ichi Morizumi
Ikuko Iwaki

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