Title:
非平面チップの組立品
Document Type and Number:
Japanese Patent JP2014527279
Kind Code:
A
Abstract:
Methods and apparatuses for assembly of a non-planar device based on curved chips are described. Slots may be created as longitudinal openings in the chips to reduce bending stresses to increase allowable degrees of deformation of the chips. The chips may be deformed to a desired deformation within the allowable degrees of deformation via the slots. Holding constraints may be provided on at least a portion of the chips to allow the chips to remain curved according the desired deformation. A non-planner integrated circuit device comprising a flexible structure and at least one fixture structure bonded to the flexible structure is also described. The flexible structure may be curved in a desired deformation. A plurality of contact areas may be included in the flexible structure. Circuitry may be embedded within the flexible structure to perform processing operations.
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Inventors:
A fan, Ron * Shen
Application Number:
JP2014510299A
Publication Date:
October 09, 2014
Filing Date:
December 08, 2011
Export Citation:
Assignee:
イリディウム Medical treatment Technology Company Limited IRIDIUM MEDICAL TECHNOLOGY CO., LTD.
International Classes:
H01L29/06; A61F2/14; A61F9/007; H01L21/02; H01L27/12; H01L27/144
Domestic Patent References:
| JP2006051164A | 2006-02-23 | |||
| JP4299783B2 | 2009-07-22 | |||
| JP2001230271A | 2001-08-24 |
Foreign References:
| US7914842B1 | 2011-03-29 |
Attorney, Agent or Firm:
Makoto Onda
Hironori Onda
Jun Honda
Hironori Onda
Jun Honda