Title:
ELECTROFORMED COMPONENT AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2015030887
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an electroformed component which allows electroformed products (contact elements) to be arranged with a narrow pitch while maintaining insulation between the electroformed products.SOLUTION: A contact element 25 (an electroformed product) is manufactured by electroforming. An insulating film 28 formed using a dry film resist and the like is installed on the surface of the contact element 25. In a manufacturing process of the contact element 25, the insulating film 28 is installed in a step after manufacturing the contact element 25.
Inventors:
HENMI YUKINOBU
SAKAI TAKAHIRO
OZAKI HIDEAKI
TERANISHI HIROSANE
SAKAI TAKAHIRO
OZAKI HIDEAKI
TERANISHI HIROSANE
Application Number:
JP2013161824A
Publication Date:
February 16, 2015
Filing Date:
August 02, 2013
Export Citation:
Assignee:
OMRON TATEISI ELECTRONICS CO
International Classes:
C25D1/00; C25D1/10; G01R1/067; G01R1/073
Domestic Patent References:
JP2010132959A | 2010-06-17 | |||
JPH11100698A | 1999-04-13 | |||
JP5073880B1 | 2012-11-14 | |||
JP2011226786A | 2011-11-10 | |||
JP2005257693A | 2005-09-22 | |||
JP2002161388A | 2002-06-04 | |||
JP2006004788A | 2006-01-05 | |||
JP2005200765A | 2005-07-28 | |||
JP2013124404A | 2013-06-24 | |||
JPH07316872A | 1995-12-05 | |||
JPH07288269A | 1995-10-31 | |||
JPH07115110A | 1995-05-02 | |||
JP2007227495A | 2007-09-06 | |||
JP2009146919A | 2009-07-02 | |||
JP2011040687A | 2011-02-24 | |||
JP2010132959A | 2010-06-17 | |||
JPH11100698A | 1999-04-13 | |||
JP5073880B1 | 2012-11-14 | |||
JP2011226786A | 2011-11-10 | |||
JP2005257693A | 2005-09-22 | |||
JP2002161388A | 2002-06-04 | |||
JP2006004788A | 2006-01-05 | |||
JP2005200765A | 2005-07-28 | |||
JP2000151078A | 2000-05-30 | |||
JP2009516080A | 2009-04-16 |
Foreign References:
WO2004068649A1 | 2004-08-12 | |||
WO2004068649A1 | 2004-08-12 |
Attorney, Agent or Firm:
Masafusa Nakano