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Title:
SURFACE-TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, COPPER CLAD LAMINATE, PRINTED WIRING BOARD, ELECTRONIC EQUIPMENT, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2015042779
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a surface-treated copper foil capable of giving such a surface profile of a substrate after removal of the copper foil that maintains an ability to form microwiring and achieves favorable adhesion strength of an electroless copper plating film.SOLUTION: The surface-treated copper foil has a surface treatment layer formed on a copper foil, in which the surface of the surface treatment layer has a particle-equivalent area ratio of 0.1 to 0.85.

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WO/2008/123211WEB PRESSURE WELDING, PRESSURE WELDING METHOD, POWER SUPPLY METHOD, POWER SUPPLY DEVICE, CONTINUOUS ELECTROLYTE PLATING DEVICE, AND METHOD FOR MANUFACTURING PLATE FILM-EQUIPPED WEB
Inventors:
KOHIKI MICHIYA
Application Number:
JP2014151259A
Publication Date:
March 05, 2015
Filing Date:
July 24, 2014
Export Citation:
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Assignee:
JX NIPPON MINING & METALS CORP
International Classes:
C25D7/06; C25D1/04; H05K1/09; H05K3/20
Domestic Patent References:
JP5204908B12013-06-05
JP2006212659A2006-08-17
JP2008047655A2008-02-28
Foreign References:
WO2012043182A12012-04-05
Attorney, Agent or Firm:
Axis international patent business corporation



 
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