Title:
SURFACE-TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, COPPER CLAD LAMINATE, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2015042785
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a surface-treated copper foil capable of giving such a surface profile of a substrate after removal of the copper foil that maintains an ability to form microwiring and achieves favorable adhesion strength of an electroless copper plating film.SOLUTION: The surface-treated copper foil has a surface treatment layer formed on a copper foil, in which a ratio B/A of a three-dimensional surface area B to a two-dimensional surface area A of the surface of the surface treatment layer is 1.05 to 1.8. When the surface-treated copper foil is laminated to a resin substrate for a printed wiring board, with the surface treatment layer side in contact with the resin substrate, and then the surface-treated copper foil is removed, the surface of the resin substrate where the copper foil is removed has a surface roughness Sz of 1 to 5 μm.
Inventors:
ISHII MASASHI
HONDA MISATO
MIYAMOTO NOBUAKI
HONDA MISATO
MIYAMOTO NOBUAKI
Application Number:
JP2014193151A
Publication Date:
March 05, 2015
Filing Date:
September 22, 2014
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP
International Classes:
C25D7/06; B32B15/08; C23C28/00; C25D1/04; C25D7/00; H05K1/09; H05K3/20; H05K3/24
Domestic Patent References:
| JP2006196863A | 2006-07-27 | |||
| JP2006196863A | 2006-07-27 | |||
| JP2009015286A | 2009-01-22 | |||
| JP5544444B1 | 2014-07-09 | |||
| JP5470493B1 | 2014-04-16 | |||
| JP5362898B1 | 2013-12-11 |
Attorney, Agent or Firm:
Axis international patent business corporation