METHOD OF MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD

Japanese Patent JP2015046570

A

PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer printed circuit board which allows for boring without causing deterioration of resin and damage on the inner layer circuit.SOLUTION: A method of manufacturing a multilayer printed circuit board includes a step for preparing a substrate 100 where an insulation layer 102 and a copper foil 103 subjected to surface treatment are formed in order on an inner layer circuit 101, a step for forming a hole exposing the insulation layer 102 by performing primary processing of a part of the copper foil 103 subjected to surface treatment and the insulation layer 102 with a laser, and a step for forming a conduction hole 201 exposing the inner layer circuit 101 by performing secondary processing of the exposed insulation layer 102 with a chemical etching liquid.

JP2000515680	INDUSTRIAL APPLICABILITY The title of the invention is a printed circuit multilayer assembly and a method for manufacturing the same.
JP6760796	Electronic element mounting boards, electronic devices and electronic modules
JP2006179589	MULTILAYER FLEXIBLE WIRING BOARD, ITS MANUFACTURING METHOD, AND CONNECTION METHOD OF MULTILAYER FLEXIBLE WIRING WITH CIRCUIT BOARD

HAN YOUN GYU
LEE DONG KYOUNG

JP2014111622A

March 12, 2015

May 29, 2014

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SAMSUNG ELECTRO MECH

H05K3/46; C23C28/00; C25D1/04; C25D1/22; C25D5/12; C25D5/48; H05K3/00

JP2000504494A	2000-04-11
JP2008060504A	2008-03-13
JP2005150447A	2005-06-09
JP2011066431A	2011-03-31
JP2011162860A	2011-08-25
JP2001262372A	2001-09-26

Ippei Watanabe
Hiroyuki Sato
Shigeru Koike

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