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Title:
COOLING SYSTEM
Document Type and Number:
Japanese Patent JP2015053311
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a cooling system which achieves high design flexibility, high cooling efficiency, and low costs.SOLUTION: A cooling unit includes: a first heat pipe 12 thermally connected with a heating component 11; multiple second heat pipes 13 thermally connected with the first heat pipe 12; and a resin layer 14 which covers parts of the multiple second heat pipes 13 and connects the multiple second heat pipes 13 with each other.

Inventors:
HIRUMA TAKAYUKI
KIMURA KAZUO
SAKAGUCHI YOSHIYA
Application Number:
JP2013183828A
Publication Date:
March 19, 2015
Filing Date:
September 05, 2013
Export Citation:
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Assignee:
PANASONIC CORP
International Classes:
H05K7/20; F28D15/02; H01L23/427
Domestic Patent References:
JPS5780748A1982-05-20
JP2007139301A2007-06-07
JP2011181731A2011-09-15
JP2012146929A2012-08-02
JP2011153776A2011-08-11
JPH11143585A1999-05-28
Foreign References:
US5506032A1996-04-09
US6776220B12004-08-17
Attorney, Agent or Firm:
Yoshiaki Tokuda
Nomura Koichi