Title:
SURFACE-TREATED COPPER FOIL AND COPPER FOIL WITH CARRIER, LAMINATED BOARD, PRINTED WIRING BOARD AND ELECTRONIC DEVICE USING SAME, AS WELL AS METHOD FOR PRODUCING PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2015061939
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a surface-treated copper foil which adheres suitably to a resin and is excellent in transparency of a resin after removing the copper foil by etching.SOLUTION: There is provided a surface-treated copper foil in which one copper foil surface and/or both copper foil surfaces are a roughening-treated surface S on which roughened particles are formed by a roughening treatment, wherein in the roughened particles on the roughening-treated surface S, the roughened particles have a width of 250 nm or less, the height of the roughened particles or the stacked height of the roughened particles is 600 nm or less and the ten-point average roughness Rz of TD of the roughening-treated surface S measured by a contact type roughness meter is 0.20 to 0.70 μm.
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Inventors:
ARAI EITA
MIKI ATSUSHI
MIKI ATSUSHI
Application Number:
JP2014166888A
Publication Date:
April 02, 2015
Filing Date:
August 19, 2014
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP
International Classes:
C25D7/06; C25D1/04; H05K1/03; H05K3/42
Domestic Patent References:
| JP2011149067A | 2011-08-04 | |||
| JP2001308477A | 2001-11-02 |
Foreign References:
| WO2013108415A1 | 2013-07-25 |
Attorney, Agent or Firm:
Axis International Patent Business Corporation