CARRIER-FITTED HOLE-OPENED METAL FOIL AND METHOD FOR PRODUCING THE SAME

Title:

CARRIER-FITTED HOLE-OPENED METAL FOIL AND METHOD FOR PRODUCING THE SAME

Document Type and Number:

Japanese Patent JP2015063730

Kind Code:

A

Abstract:

PROBLEM TO BE SOLVED: To provide hole-opened metal foil free from the generation of burrs and the loss of metal in a production step, and in which seamless, fine-patterned through holes are formed, and a method for producing the hole-opened metal foil.SOLUTION: Provided is carrier-fitted hole-opened metal foil having a carrier 6 made of a pattern-shaped copper vapor-deposited layer 3 formed on one side of a supporting body 1 and a peeling layer 4 formed on the pattern-shaped copper vapor-deposited layer, and having hole-opened metal foil 5 by electrolytic metal plating treatment formed only on the peeling layer of the carrier.

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Inventors:

MATSUURA TAKANORI
TAKAHASHI TOSHIYUKI

Application Number:

JP2013198245A

Publication Date:

April 09, 2015

Filing Date:

September 25, 2013

Export Citation:

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Assignee:

SEIREN CO LTD

International Classes:

C25D1/04; C25D5/56; H01M4/74

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