Title:
COOLING DEVICE
Document Type and Number:
Japanese Patent JP2015064141
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a cooling device that can inhibit a refrigerant from non-uniformly flowing in a specific heat transfer pipe while making a configuration of a heat release section as compact as possible even when transmitted heat quantity is relatively large.SOLUTION: A cooling device 10 includes a plurality of cooling circuits 20 that receive heat from a cooling target and release the heat from a common heat release section 13 by automatically circulating a refrigerant. Each of the cooling circuits 20 includes: a heat receiving device 22 that receives heat from the cooling target to vaporize the refrigerant; a radiator 30 that includes a plurality of heat transfer pipes interconnected in parallel and having the refrigerant flowing therein and that releases the heat of the vaporized refrigerant in the heat transfer pipes to liquefy the refrigerant; gas-phase refrigerant piping 24 for sending the refrigerant vaporized in the heat receiving device 22 to the radiator 30; and liquid-phase refrigerant piping 28 for sending the refrigerant liquefied in the radiator 30 to the heat receiving device 22. The common heat release section 13 is configured by aligning the plurality of radiators 30 vertically.
Inventors:
KATSUKI RYOJI
AKIBA MIYUKI
YOSHII TOSHIHIRO
YANAGISAWA NAOMICHI
AKIBA MIYUKI
YOSHII TOSHIHIRO
YANAGISAWA NAOMICHI
Application Number:
JP2013198611A
Publication Date:
April 09, 2015
Filing Date:
September 25, 2013
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
F28D15/02
Attorney, Agent or Firm:
Patent Business Corporation Sakura International Patent Office