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Title:
METHOD FOR HYDROFORM MOLDING OF HOLLOW STRUCTURE COMPONENT
Document Type and Number:
Japanese Patent JP2015066594
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To preferably mold a hollow structure component of uniform plate thickness.SOLUTION: For pushing wide a junction plate material 12 to make hydroform molding of a hollow structure component shaped in accordance with a female die recess space 11A, a width dimension of the blank portion 12Y of the junction plate material 12 extending from a longest constant region S3 that has a constant inner peripheral length and extends longest in an internal space S the recess space 11A forms toward the outer peripheral edge part 11B of the recess space 11A is set largest. A width dimension of the blank portion 12Y extending from a shorter part than the longest constant region S3 toward the outer peripheral edge part 11B of the recess space 11A is set so as to get smaller than that the width dimension of the blank portion 12Y extending from the longest constant region S3 as the length of a shorter part than the longest constant region S3 gets shorter than the longest constant region S3. Additionally, the clearance between the outer peripheral edge parts 11B of the recess space 11A is set larger than the thickness of the blank portion 12Y.

Inventors:
YAMADA HAJIME
NISHIKATA ERI
TAKADA YASUHIRO
Application Number:
JP2013205648A
Publication Date:
April 13, 2015
Filing Date:
September 30, 2013
Export Citation:
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Assignee:
HONDA MOTOR CO LTD
International Classes:
B21D26/025; B21D26/053
Domestic Patent References:
JP2005021982A2005-01-27
JP2005254286A2005-09-22
JP2005313203A2005-11-10
JP2003211232A2003-07-29
JP2012213793A2012-11-08
JP2003025022A2003-01-28
JP2002273526A2002-09-25
JP3654210B22005-06-02
JP2005021982A2005-01-27
Attorney, Agent or Firm:
Masatake Shiga
Yoshifumi Saeki
Mitsuo Teramoto
Suzuki Mitsuyoshi
Shingo Suzuki