Title:
RADIATOR MECHANISM AND TESTING METHOD
Document Type and Number:
Japanese Patent JP2015152280
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To efficiently cool a plurality of semiconductor devices and to facilitate and ensure that temperatures of the semiconductor devices are approximated to be automatically controlled within a predetermined temperature range without the need of temperature control over the individual semiconductor devices, even if the semiconductor devices differ in heating value.SOLUTION: A radiator mechanism includes a heat pipe structure located above an IC 20 and circulating heat by a working fluid supplied into the heat pipe structure, the heat pipe structure being disposed above each of ICs 20 and including a first heat pipe 14 volatilizing the working fluid by heat generated in each IC 20, a second heat pipe 15 communicating with the first heat pipe 14 and moving the working fluid remaining surplus in the first heat pipe 14, and a third heat pipe 16 disposed above the second heat pipe 15, communicating with the first heat pipe 14, and cooling the volatilized working fluid.
More Like This:
Inventors:
MUROTANI HIROYUKI
KOBASHI NAOTO
KOIKE HIROYUKI
NAKAMURA HIDEAKI
KOBASHI NAOTO
KOIKE HIROYUKI
NAKAMURA HIDEAKI
Application Number:
JP2014028852A
Publication Date:
August 24, 2015
Filing Date:
February 18, 2014
Export Citation:
Assignee:
SOCIONEXT INC
International Classes:
F28D15/02; H01L23/427
Attorney, Agent or Firm:
Takayoshi Kokubun