Title:
COPPER FOIL WITH CARRIER, PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, COPPER-CLAD LAMINATE, AND MANUFACTURING METHOD OF PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2015163740
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a copper foil with a carrier having excellent circuit formability on the surface of an ultrathin copper layer.SOLUTION: A copper foil with a carrier has the carrier, an intermediate layer, an ultrathin copper layer and a roughening-treated layer in this order. In the copper foil with the carrier, the absorption rate of light whose wavelength is 400 nm is 85% or higher on the surface of the ultrathin copper layer, and the ultrathin copper layer is peelable by being peeled from the carrier.
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Inventors:
NAGAURA YUTA
Application Number:
JP2015078079A
Publication Date:
September 10, 2015
Filing Date:
April 06, 2015
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP
International Classes:
C23C28/00; B32B15/08; C25D1/04; C25D5/00; C25D7/06; H05K1/09
Attorney, Agent or Firm:
Axis International Patent Business Corporation