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Title:
SURFACE-TREATED COPPER FOIL, CARRIER-PROVIDED COPPER FOIL, PRINTED WIRING BOARD, PRINT CIRCUIT BOARD, COPPER CLAD LAMINATE SHEET AND METHOD OF PRODUCING PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2015172250
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide surface-treated copper foil excellent in fine wiring formation.SOLUTION: Surface-treated copper foil is provided with a surface treatment layer formed on copper foil. When spray-etched with a hydrogen peroxide/sulfuric acid type copper dissolving etching liquid from the surface opposite to the surface formed with the surface treatment layer, with the thickness-direction etching rate of the copper foil taken as 1, the thickness-direction etching rate of the surface treatment layer is 0.5 or greater. The surface treatment layer is e.g. a roughened layer, a heat-resistant layer, a rust preventive layer, a chromate-treated layer or a silane coupling-treated layer.

Inventors:
MIYAMOTO NOBUAKI
SASAKI SHINICHI
ISHII MASASHI
Application Number:
JP2015096953A
Publication Date:
October 01, 2015
Filing Date:
May 11, 2015
Export Citation:
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Assignee:
JX NIPPON MINING & METALS CORP
International Classes:
C25D7/06; B32B15/08; C23F1/18; C25D1/04; H05K1/09
Domestic Patent References:
JP2012246567A2012-12-13
JP2006210689A2006-08-10
JP2002161394A2002-06-04
JP2002069691A2002-03-08
JPH09195096A1997-07-29
JP2002506121A2002-02-26
JP2005254673A2005-09-22
JPH0940933A1997-02-10
JP2008140902A2008-06-19
JP2003158364A2003-05-30
JP2012255180A2012-12-27
JP2011219790A2011-11-04
Foreign References:
WO2008149772A12008-12-11
WO2013136729A12013-09-19
Attorney, Agent or Firm:
Axis International Patent Business Corporation