SURFACE-TREATED COPPER FOIL, COPPER-CLAD LAMINATE, PRINT CIRCUIT BOARD, ELECTRONIC APPARATUS, CIRCUIT FORMING BASE PLATE FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING PRINT CIRCUIT BOARD

Title:

Document Type and Number:

Japanese Patent JP2015183240

Kind Code:

A

Abstract:

PROBLEM TO BE SOLVED: To provide a surface-treated copper foil free from the need of etching when removing a copper foil from a resin substrate after sticking the resin substrate to the copper foil, and enabling removing a copper foil at an excellent cost without spoiling the profile of a copper foil surface transferred to the surface of the resin substrate.SOLUTION: A surface-treated copper foil includes: a copper foil having no roughened particle and surface ruggedness having 0.1-5.0 μm of Rz measured in accordance with JIS B0601 (1994 year) or a copper foil having roughened particles; and a release layer provided on a surface of a copper foil having copper foil surface ruggedness or a surface of a copper foil having roughened particles, and making a resin substrate peelable when sticking the resin substrate to a copper foil from a release layer side.

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Inventors:

ISHII MASASHI
MORIYAMA AKIMASA

Application Number:

JP2014061259A

Publication Date:

October 22, 2015

Filing Date:

March 25, 2014

Export Citation:

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Assignee:

JX NIPPON MINING & METALS CORP

International Classes:

C25D7/06; B32B15/04; C23C18/22; C25D1/04; H05K3/38

Domestic Patent References:

JPH0647755A	1994-02-22
JP2013243396A	2013-12-05

Foreign References:

WO2013183607A1	2013-12-12
WO2014024878A1	2014-02-13

Attorney, Agent or Firm:

Axis International Patent Business Corporation

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