Title:
METHODS FOR MANUFACTURING COPPER FOIL WITH CARRIER, COPPER-CLAD LAMINATE, AND PRINTED WIRING BOARD, AND COPPER-CLAD LAMINATE, ELECTRONIC DEVICE, AND COPPER FOIL WITH CARRIER
Document Type and Number:
Japanese Patent JP2016050355
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing copper foil with carrier that provides a good circuit formability to an ultra-thin copper layer, and also to provide copper foil with carrier that provides a good wettability with respect to the etchant.SOLUTION: Provided is a method for manufacturing copper foil with carrier, including a heat treatment step for carrying out a heat treatment to copper foil with carrier having a carrier, an intermediate layer, an ultra-thin copper layer, and a surface treatment layer comprising a silane coupling treatment layer, in this order, at a heating temperature of 100°C to 220°C for 1 to 8 hours.SELECTED DRAWING: Figure 4
Inventors:
MORIYAMA AKIMASA
NAGAURA YUTA
NAGAURA YUTA
Application Number:
JP2015046405A
Publication Date:
April 11, 2016
Filing Date:
March 09, 2015
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP
International Classes:
C25D1/04; B32B15/20; C25D5/50; C25D7/06; H05K3/00
Domestic Patent References:
| JP2007152796A | 2007-06-21 | |||
| JP2011068142A | 2011-04-07 | |||
| JPS6015654B2 | 1985-04-20 | |||
| JPS63161127A | 1988-07-04 | |||
| JP2015193884A | 2015-11-05 |
Attorney, Agent or Firm:
Axis International Patent Business Corporation