Title:
COPPER FOIL WITH CARRIER, COPPER-CLAD LAMINATE, PRINTED WIRING BOARD, ELECTRONIC DEVICE, AND LAMINATE, AND METHODS FOR MANUFACTURING COPPER FOIL WITH CARRIER, COPPER-CLAD LAMINATE, AND PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2016050364
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide copper foil with carrier in which the variation in carrier peel strength between before and after heat pressing of the copper foil with carrier is well suppressed.SOLUTION: Provided is copper foil with carrier having a carrier, an intermediate layer, and an ultra-thin copper layer in this order, and in which the peel strength of the carrier after heat pressing of the copper foil with carrier under the condition of a pressure: 20 kgf/cmand 220°C for 2 hours, is 150% or less of the peel strength before the heat pressing, and the peel strength of the carrier after the heat pressing under the condition of a pressure: 20 kgf/cmand 220°C for 2 hours, is 2 N/m or more and 30 N/m or less.SELECTED DRAWING: Figure 1
More Like This:
Inventors:
NAGAURA YUTA
Application Number:
JP2015171436A
Publication Date:
April 11, 2016
Filing Date:
August 31, 2015
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP
International Classes:
C25D1/04; B32B15/08; C25D1/20; C25D5/50; H05K1/09; H05K3/20
Domestic Patent References:
| JP5298252B1 | 2013-09-25 |
Foreign References:
| WO2013118416A1 | 2013-08-15 | |||
| WO2014084385A1 | 2014-06-05 | |||
| WO2004005588A1 | 2004-01-15 |
Attorney, Agent or Firm:
Axis International Patent Business Corporation