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Title:
METHOD FOR BURYING MEASURING INSTRUMENT
Document Type and Number:
Japanese Patent JP2016079705
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a measuring instrument used for monitoring during ground improvement work and surveys after completion, the measuring instrument being economically efficient and free of a concern over wire breaking.SOLUTION: An established area 2, to which a cement-based solidification material is added and mixed, is formed in a ground 1, while a measuring sensor 5 is installed inside a hollow tube 3, after detachably fitting a closing part 7 on an opening 6 at a tip of the hollow tube 3 and fitting an end of a holding wire 8 near a central part on an inner surface of the closing part, the measuring sensor being fitted on the holding wire. The hollow tube 3 is penetrated into the established area 2, to a prescribed depth, before the cement-based solidification material solidifies. Then, the other end of the holding wire 8 is supported at a ground surface side such that the holding wire is almost parallel with a material axis of the hollow tube 3, and only the hollow tube 3 is pulled out from the established area 2. This way, the measuring sensor 5 is left in the established area 2, along with the holding wire 8 and the closing part 7.SELECTED DRAWING: Figure 2

Inventors:
HATA KOJI
Application Number:
JP2014212954A
Publication Date:
May 16, 2016
Filing Date:
October 17, 2014
Export Citation:
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Assignee:
OHBAYASHI CORP
International Classes:
E02D1/00; E02D3/12; G01N3/00; G01N33/24
Domestic Patent References:
JPH10253601A1998-09-25
JPH0417489U1992-02-13
JP2005256519A2005-09-22
JPS5024763B11975-08-19
JPS6278310A1987-04-10
JP2005213879A2005-08-11
JP2012127758A2012-07-05
JPS6150124U1986-04-04
JP2003166231A2003-06-13
Foreign References:
EP1884599A22008-02-06
Attorney, Agent or Firm:
Satoshi Kubo