Title:
SURFACE-TREATED COPPER FOIL, COPPER-CLAD LAMINATE, METHOD FOR PRODUCING PRINTED WIRING BOARD, METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING ELECTRONIC APPARATUS
Document Type and Number:
Japanese Patent JP2016135924
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a surface-treated copper foil capable of removing a copper foil at a good cost without requiring etching treatment and damaging the profile of the surface of the copper foil transferred to the surface of a resin substrate when removing the copper foil from the resin substrate after sticking of the resin substrate to the copper foil.SOLUTION: There is provided a surface-treated copper foil which comprises a copper foil having no roughened particles and a surface roughness of Rz of 0.1 to 5.0 μm as measured in accordance with JIS B0601 (1994 year) and a release layer which is provided on a surface of a copper foil having surface unevenness and makes a resin substrate peelable when sticking the resin substrate to a copper foil from a release layer side, where the surface-treated copper foil is used for a method for producing a resin substrate which comprises a step of sticking the resin substrate to the surface-treated copper foil from the release layer side and a step of peeling the surface-treated copper foil from the resin substrate without etching to obtain a resin substrate in which the surface profile of the copper foil is transferred to the peeling surface or a method for transferring the surface profile of the copper foil to the resin substrate.SELECTED DRAWING: Figure 1
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Inventors:
ISHII MASASHI
MORIYAMA AKIMASA
MORIYAMA AKIMASA
Application Number:
JP2016038108A
Publication Date:
July 28, 2016
Filing Date:
February 29, 2016
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP
International Classes:
C25D1/22; B32B5/10; B32B15/08; B32B15/20; H05K1/03; H05K1/09; H05K3/38
Domestic Patent References:
JP2013243396A | 2013-12-05 | |||
JPH0647755A | 1994-02-22 | |||
JP2013243396A | 2013-12-05 | |||
JPH0647755A | 1994-02-22 |
Foreign References:
WO2013183607A1 | 2013-12-12 | |||
WO2014024878A1 | 2014-02-13 | |||
WO2013183607A1 | 2013-12-12 | |||
WO2014024878A1 | 2014-02-13 |
Attorney, Agent or Firm:
Axis International Patent Business Corporation