Title:
HOT-MELT ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JP2016138222
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a hot-melt adhesive composition inhibiting blocking of hot-melt adhesive compositions at live load even under high temperature and high humidity environment and good in adhesiveness to hard adhesive carton paper.SOLUTION: There is provided a hot-melt adhesive composition having a main component of the hot-melt adhesive and a coating material for coating a surface of the main component, where the main component contains an olefin resin, a tackifier resin having the softening point by a ring and ball method of 120°C or less and wax having the melting point by a differential scanning calorimetry of 100°C or less, the coating material is by mixing polyethylene wax with an anionic surfactant having an anion type main hydrophilic group.SELECTED DRAWING: None
Inventors:
KUWABARA NORIKO
SHIMIZU TETSUYA
SHIMIZU TETSUYA
Application Number:
JP2015015403A
Publication Date:
August 04, 2016
Filing Date:
January 29, 2015
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C09J123/00; C09D5/00; C09D123/04; C09D191/06; C09J5/06; C09J11/06; C09J11/08; C09J131/04
Domestic Patent References:
| JP2014051631A | 2014-03-20 | |||
| JP2001262108A | 2001-09-26 | |||
| JP2006117829A | 2006-05-11 | |||
| JPH0977890A | 1997-03-25 | |||
| JP2012082312A | 2012-04-26 | |||
| JP2001316651A | 2001-11-16 |
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