Title:
COPPER FOIL WITH CARRIER, LAMINATE, PRINTED WIRING BOARD AND METHOD FOR PRODUCING PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2016145390
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a copper foil with a carrier which satisfactorily suppresses falling of roughened particles in a roughened particle layer provided on a side surface of an ultrathin copper layer and has good peel strength.SOLUTION: There is provided a copper foil with a carrier which comprises a carrier, an intermediate layer, an ultrathin copper layer and a surface treatment layer containing a roughening-treated layer in this order, wherein the number of particles having a diameter more than 1 μm of roughened particles constituting the roughening-treated layer is suppressed to 5 pieces or less in the range of 10 μm square and roughened particles having a diameter of 0.1 μm or more and 1 μm or less are present in a density of 500 pieces or more and 3000 pieces or less in the range of 10 μm square.SELECTED DRAWING: Figure 1
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Inventors:
MORIYAMA AKIMASA
Application Number:
JP2015022749A
Publication Date:
August 12, 2016
Filing Date:
February 07, 2015
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP
International Classes:
C25D7/06; B32B15/01; C25D1/04; C25D5/16; H05K1/09; H05K3/38; H05K3/46
Domestic Patent References:
| JP2015024515A | 2015-02-05 | |||
| JP2005344207A | 2005-12-15 | |||
| JP2012099857A | 2012-05-24 | |||
| JP2014082490A | 2014-05-08 |
Foreign References:
| WO2014200106A1 | 2014-12-18 | |||
| WO2013108415A1 | 2013-07-25 |
Attorney, Agent or Firm:
Axis International Patent Business Corporation