Title:
TREATMENT COPPER FOIL, COPPER-CLAD LAMINATE USING THE TREATMENT COPPER FOIL, AND PRINT CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2016149438
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a highly transparent treatment copper foil preferable for a print circuit board, which has excellent transmission characteristics, a high peeling strength with a resin base material, and a low degree of cloudiness (HAZE level) after etching.SOLUTION: There is provided a treatment copper foil for a copper-clad laminate, including a roughening treatment layer 2 on at least one surface of an untreated copper foil 1 and an antioxidation treatment layer 3 on the roughening treatment layer 2. The roughening treatment layer 2 is made of fine copper particles with primary particles having diameters of 40nm to 200nm, and the antioxidation treatment layer 3 contains molybdenum and cobalt. The ten point height of irregularities, Rz of the treatment surface to be adhered to an insulating resin base material is 0.5 μm to 1.6 μm, and the color difference ΔE*ab between the untreated copper foil 1 and the treatment surface is 45 to 60.SELECTED DRAWING: Figure 1
Inventors:
OKAMOTO TAKESHI
MANABE HISATOKU
MANABE HISATOKU
Application Number:
JP2015025259A
Publication Date:
August 18, 2016
Filing Date:
February 12, 2015
Export Citation:
Assignee:
FUKUDA METAL FOIL & POWDER CO LTD
International Classes:
H05K1/09; C25D1/04; C25D3/38; C25D7/06
Domestic Patent References:
| JPH0335394B2 | 1991-05-28 | |||
| JP2011219790A | 2011-11-04 | |||
| JP2005206915A | 2005-08-04 | |||
| JP2006210689A | 2006-08-10 | |||
| JP2014141738A | 2014-08-07 |
Attorney, Agent or Firm:
Junichi Ando
Uemura Yoshinaga
Makiko Maekawa
Uemura Yoshinaga
Makiko Maekawa