COMPOSITION USED FOR TEMPORARY PROTECTION OF SUBSTRATE CONTAINING WIRING FORMED BY TRANSPARENT CONDUCTIVE FILM, COATED FILM AND TEMPORARY PROTECTIVE METHOD

Japanese Patent JP2016153463

A

PROBLEM TO BE SOLVED: To improve tack fee property of a coated film, detachability from an ITO film, a glass and an acrylic overcoat film and moistureproofness in a composition used for temporary protective of a substrate containing wiring formed by a transparent conductive film, and to eliminate energy loss by reducing operation time when using a PVA film as a protective film in the temporary protective method of the substrate containing wiring formed by the transparent conducive film.SOLUTION: The composition contains a styrenic thermoplastic elastomer, a plasticizer and a solvent. The method includes a process of applying the composition to a substrate containing wiring formed by a transparent conducive film, a process of forming a coated film on the substrate containing wiring formed by a transparent conductive film by evaporating the solvent, a process of detaching the coated film formed in the process 2 from an end part of the coated film without using a liquid to peel the coated film from the substrate containing wiring formed by the transparent conductive film.SELECTED DRAWING: None

OGA KAZUHIKO
TSUBAKI CHIEKO

JP2015032202A

August 25, 2016

February 20, 2015

Click for automatic bibliography generation  

SHOWA DENKO KK

C09D125/04; C08K5/12; C08L53/00; C09D5/20; C09D7/12; C09D125/08; G06F3/041; G06F3/044

JPS63217642A	1988-09-09
JP2012167144A	2012-09-06
JP2007314710A	2007-12-06
JPS63135472A	1988-06-07
JP2014144023A	2014-08-14
JP2008195927A	2008-08-28
JP2001003031A	2001-01-09
JP2001003026A	2001-01-09

Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Nagasaka Tomoyasu
Yoshihiro Kobayashi
Atsushi Ebiya

Previous Patent: RUBBER COMPOSITION FOR TIRE

Next Patent: (METH)ACRYLIC POLYMER AND MANUFACTURING METHOD