Title:
PLATING DEVICE, PLATING METHOD AND JIG FOR PLATING
Document Type and Number:
Japanese Patent JP2018035380
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a plating device capable of conducting plating or composite plating with same quality even shortening operation time by enhancing reaction efficiency of plating, a plating method and a jig for plating.SOLUTION: A plating treatment is conducted by using a plating device A in which a plating jog B having a housing part 60 with a top face opening, and having an inner space capable of housing an article to be plated 20 in a plating liquid 5, a suction part 80 arranged at lower end side of the housing part 60 and having a suction opening 8e connecting to the suction part 7a of a liquid circulation means 7 in a plating tank 1 so that the suction part 7a and a discharge 7f are in the plating liquid 5 and can aspirate the plating liquid 5 in the housing part 60 from blow, and a tabular suction part 100 having a plurality of flow ports 100a through which the plating liquid can flow to the tabular member and arranged in a lower side of the housing part 60 and/or an upper side of the suction part 80 to include between the article to be plated 20 in the housing part 60 and a suction port 8e of the suction part 80 is arranged in a plating tank 1 by a supporting part 90.SELECTED DRAWING: Figure 1
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Inventors:
NAKAGAWA KAZUYUKI
YAMAMOTO SHINYA
MATSUMURA MUNEYORI
YAMAMOTO SHINYA
MATSUMURA MUNEYORI
Application Number:
JP2016166809A
Publication Date:
March 08, 2018
Filing Date:
August 29, 2016
Export Citation:
Assignee:
NIPPON SEIKI HOSEKI KOGYO KK
International Classes:
C25D15/02; C23C18/31; C23C18/52; C25D17/00
Domestic Patent References:
| JPH04333598A | 1992-11-20 |
Foreign References:
| US6306025B1 | 2001-10-23 |
Attorney, Agent or Firm:
Yuko Nishikawa