Title:
JIG FOR REMOVAL OF SUBSTRATE
Document Type and Number:
Japanese Patent JP2018062019
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a jig for removal of a substrate which can be used in an attachment state of more substrates.SOLUTION: A jig 6 for a substrate assists removal of a PCU substrate 5 from a PCU 1 by holding the PCU substrate 5 fitted to the PCU 1. The jig 6 for a substrate comprises a body part 60 which is so used as to be overlapped on the PCU substrate 5. The body part 60 is provided with a holding part 73 (slide clip 70) which holds the PCU substrate 5 through engagement with a notch 55, which is provided on an outline inner side of a substrate body 50, in the state that the body part 60 is overlapped on the PCU substrate 5.SELECTED DRAWING: Figure 10
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Inventors:
KAWAI TOSHIHIRO
SAKAI HIDEAKI
IWATA KUNIHIRO
SUZUKI KUNIHIRO
SAKAI HIDEAKI
IWATA KUNIHIRO
SUZUKI KUNIHIRO
Application Number:
JP2016200445A
Publication Date:
April 19, 2018
Filing Date:
October 11, 2016
Export Citation:
Assignee:
TOYOTA TEKKO KK
TOYOTA MOTOR CORP
TOYOTA MOTOR CORP
International Classes:
B25B27/14
Attorney, Agent or Firm:
Makoto Onda
Hironobu Onda
Hironobu Onda