Title:
WETTING AGENT
Document Type and Number:
Japanese Patent JP2018062597
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a wetting agent that can reduce rough surfaces and surface defects and improve polishing rates in polishing a hydrophobic surface for producing a semiconductor.SOLUTION: A wetting agent contains a polymer compound containing structures represented by formulas (1), (2) (Zis a substituent containing one or both of O and N).SELECTED DRAWING: None
Inventors:
KATO YUKI
IGARASHI TADASHI
MIURA JOJI
IGARASHI TADASHI
MIURA JOJI
Application Number:
JP2016202577A
Publication Date:
April 19, 2018
Filing Date:
October 14, 2016
Export Citation:
Assignee:
KAO CORP
International Classes:
C09K3/00; B24B37/00; C09K3/14; H01L21/304
Domestic Patent References:
| JP2005275231A | 2005-10-06 | |||
| JP2015095582A | 2015-05-18 | |||
| JP2016124943A | 2016-07-11 | |||
| JP2015076494A | 2015-04-20 |
Foreign References:
| WO1998013394A1 | 1998-04-02 |
Attorney, Agent or Firm:
Ikeuchi, Sato & Partners