Title:
EPOXY RESIN COMPOSITION, EPOXY RESIN CURED PRODUCT, HEAT CONDUCTION FILM, AND METHOD FOR PRODUCING EPOXY RESIN CURED PRODUCT
Document Type and Number:
Japanese Patent JP2018062604
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an epoxy resin composition that can form a thin film well and shows excellent heat conductivity in a cured state, an epoxy resin cured product, a heat conduction film, and a method for producing an epoxy resin cured product.SOLUTION: An epoxy resin composition contains an epoxy compound and a curing agent, can form a smectic liquid crystal structure, and is of reaction induction type. The epoxy resin composition contains no filler, or contains a filler but its content is not more than 20 mass% of the total content of nonvolatile matter of the epoxy resin composition.SELECTED DRAWING: None
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Inventors:
TAKEZAWA YOSHITAKA
TANAKA SHINGO
HOJO FUSAO
TANAKA SHINGO
HOJO FUSAO
Application Number:
JP2016202698A
Publication Date:
April 19, 2018
Filing Date:
October 14, 2016
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08G59/24
Domestic Patent References:
| JP2016155985A | 2016-09-01 | |||
| JP2011074366A | 2011-04-14 | |||
| JP2013216038A | 2013-10-24 |
Foreign References:
| WO2016104788A1 | 2016-06-30 |
Attorney, Agent or Firm:
Patent Service Corporation Taiyo International Patent Office