Title:
HEAT EXCHANGER FOR ADJUSTING SURFACE TEMPERATURE OF POLISHING PAD, POLISHING DEVICE, POLISHING METHOD AND RECORDING MEDIUM IN WHICH COMPUTER PROGRAM IS RECORDED
Document Type and Number:
Japanese Patent JP2018122406
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a heat exchanger with which surface temperature of a polishing pad can reach target temperature immediately and even temperature distribution can be provide at a surface of the polishing pad.SOLUTION: A heat exchanger 11 includes: a pad contact surface 65 capable of coming into contact with a polishing pad 3; a heating flow passage 61 through which heating fluid flows; and a cooling flow passage 62 through which cooling fluid flows. The heating flow passage 61 and the cooling flow passage 62 are adjacent to each other from the starting end thereof to the terminal end thereof. The heating flow passage 61 and the cooling flow passage 62 cross with each other sterically in a peripheral edge part of the pad contact surface 65.SELECTED DRAWING: Figure 2
Inventors:
ETO YOHEI
MARUYAMA TORU
MARUYAMA TORU
Application Number:
JP2017017401A
Publication Date:
August 09, 2018
Filing Date:
February 02, 2017
Export Citation:
Assignee:
EBARA CORP
International Classes:
H01L21/304; B24B37/015
Attorney, Agent or Firm:
Tetsuya Hirosawa
Isamu Watanabe
Isamu Watanabe