Title:
METAL RECOVERY METHOD
Document Type and Number:
Japanese Patent JP2018123356
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a metal recovery method where, without requiring complicated machines such as a vibration device, the separation of electronic components can be easily performed from a printed circuit board, and further, the electronic components, solder fitted with the electronic components to the printed circuit board and the printed circuit board from which the electronic components have been separated are respectively fractionated to efficiently recover high purity metal.SOLUTION: Provided is a metal recovery method where metal is recovered from a printed circuit board fitted with electronic components, comprising: a separation step where while carrying the printed circuit board by a carrying means, during heating or after heating, the same is dropped off from the carrying means to apply impact to the printed circuit, and the electronic components are separated from the printed circuit board; a fractional step where the electronic components, solder fitted with the electronic components to the printed circuit board and teh printed circuit board from which the electronic components have been separated are fractionated, respectively; and a metal recovery step where the fractionated electronic components and the printed circuit board from which the electronic components have been separated are immersed into a treatment solution containing ferric chloride, respectively to dissolve metal, and the metal is recovered from the obtained treatment-finished liquid.SELECTED DRAWING: Figure 1
Inventors:
KOMORI YUJI
INOUE EIJI
INOUE NOBUHIRO
KONISHI MASAKAZU
INOUE EIJI
INOUE NOBUHIRO
KONISHI MASAKAZU
Application Number:
JP2017014700A
Publication Date:
August 09, 2018
Filing Date:
January 30, 2017
Export Citation:
Assignee:
ASTEC IRIE CO LTD
International Classes:
C22B7/00; C22B3/04; C22B11/00; C22B13/00; C22B15/00; C22B19/20; C22B23/00; C22B25/00; C22B30/02; C22B30/06; C22B58/00
Domestic Patent References:
| JPS5637699A | 1981-04-11 | |||
| JPH08148823A | 1996-06-07 | |||
| JP2013230437A | 2013-11-14 | |||
| JP2016160493A | 2016-09-05 | |||
| JPH0813051A | 1996-01-16 | |||
| JP2014510195A | 2014-04-24 | |||
| JP2013181181A | 2013-09-12 |
Attorney, Agent or Firm:
Patent Business Corporation Koei Patent Office