Title:
COMPOSITE STRUCTURES HAVING BOND LINES WITH MATCHED ELECTRICAL CONDUCTIVITY
Document Type and Number:
Japanese Patent JP2018127211
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method for connecting a composite structure along a bond line which mitigates effect of lightning strikes and reduces accompanying electrical potential occurring across the exposed bond line.SOLUTION: Two composite laminates are connected and joined together by a bond line having portions exposed to an ambient environment. The bond line contains scrim having electrical conductivity and impedance matched to those of the laminates in order to mitigate effect of lightning strikes.SELECTED DRAWING: Figure 1
Inventors:
ACKERMAN PATRICE K
DIANE L HEIDLEBAUGH
DIANE L HEIDLEBAUGH
Application Number:
JP2018041512A
Publication Date:
August 16, 2018
Filing Date:
March 08, 2018
Export Citation:
Assignee:
BOEING CO
International Classes:
B64C1/00; B29C65/48; B32B1/02; B32B5/02; B32B5/26; B32B7/12; B32B27/04; B64C3/34; B64D45/02; B64F5/40
Domestic Patent References:
| JP2001510422A | 2001-07-31 | |||
| JP2012162148A | 2012-08-30 | |||
| JP2008530270A | 2008-08-07 | |||
| JP2010536622A | 2010-12-02 | |||
| JP2011051517A | 2011-03-17 |
Foreign References:
| US4556591A | 1985-12-03 | |||
| WO2012050338A2 | 2012-04-19 |
Attorney, Agent or Firm:
Sonoda/Kobayashi Patent Business Corporation