Title:
RESIN COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN SHEET, AND PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2018131541
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition that has properties required for a laminate for a printed wiring board, particularly excellent in copper foil peel strength, plating peel strength, flexural strength, glass transition temperature (Tg), thermal expansivity, and thermal conductivity; and a prepreg, a metal foil-clad laminate, a resin sheet, and a printed wiring board using the resin composition.SOLUTION: A resin composition contains a maleimide compound (A) represented by the formula (1) and a cyanate ester compound (B).SELECTED DRAWING: None
Inventors:
KOGA SHOTA
TAKANO KENTARO
TAKANO KENTARO
Application Number:
JP2017026261A
Publication Date:
August 23, 2018
Filing Date:
February 15, 2017
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO
International Classes:
C08L79/04; C08J5/24; C08K5/3412; H05K1/03
Domestic Patent References:
| JP2007045968A | 2007-02-22 | |||
| JP2009024056A | 2009-02-05 | |||
| JP2003238681A | 2003-08-27 |
Foreign References:
| WO2012090578A1 | 2012-07-05 | |||
| WO2013008684A1 | 2013-01-17 | |||
| WO2016010033A1 | 2016-01-21 |
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Kazuhiko Naito
Toshifumi Onuki
Kazuhiko Naito