Title:
BONDING WIRE RESIN SEALING STRUCTURE, LIQUID CRYSTAL DISPLAY DEVICE, AND BONDING WIRE RESIN SEALING METHOD
Document Type and Number:
Japanese Patent JP2018136409
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a bonding wire resin sealing structure that can ensure reliability even in a severe environment by reducing a displacement difference occurring due to a difference in coefficient of thermal expansion that is the cause of breakage of a bonding wire.SOLUTION: A bonding wire resin sealing structure 7 comprises: a first substrate 10; a second substrate 50; a bonding wire 4; a sealing resin 6; and a cavity part 5. The first substrate 10 has a first connection terminal 13. The second substrate 50 is fixed to the first substrate 10 and has a second connection terminal 51. The bonding wire 4 has an arcuate loop part 4a and connects the first connection terminal 13 to the second connection terminal 51. The sealing resin 6 is formed on the first and second substrates 10 and 50 and seals the bonding wire 4. The cavity part 5 is arranged in an area between the first connection terminal 13 and second connection terminal 51 in the sealing resin 6, the area toward the center point of the arc of the loop part 4a.SELECTED DRAWING: Figure 3
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Inventors:
KURIHARA MAKOTO
Application Number:
JP2017030055A
Publication Date:
August 30, 2018
Filing Date:
February 21, 2017
Export Citation:
Assignee:
JVC KENWOOD CORP
International Classes:
G02F1/1333; G02F1/1345; G09F9/00; H01L21/56; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Hidekazu Miyoshi
Shunichi Takahashi
Shunichi Takahashi