Title:
PARTIAL PLATING DEVICE, PARTIAL PLATING METHOD AND METHOD FOR PRODUCING PARTIAL PLATING MEMBER
Document Type and Number:
Japanese Patent JP2018145515
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a partial plating method and device capable of inexpensively and efficiently performing partial plating by sufficiently stirring a plating solution and by securing a stable amount thereof, in performing electroplating partially on an area extending along the longitudinal direction of a band plate-shaped material to be plated.SOLUTION: There is provided a partial plating device 1 performing partial electroplating on a belt-like plated area 9a extending along the longitudinal direction of at least one side of a band plate-shaped plated material 9, which is continuously supplied into a plating tank 4, including: a band plate-shaped shield plate 13 disposed so as to face a non-plated area 9b of the plated material 9 between a conveyance path of the plated material 9 and an anode 11, extending along the longitudinal direction of the plated material 9 which is supplied into the plating tank 4; and a plating solution jetting part 22 making the plating solution flow along the longitudinal direction of the plated area 9a of the plated material 9.SELECTED DRAWING: Figure 1
Inventors:
SATO YOSUKE
SHINOHARA KEISUKE
ARAKI HISATOSHI
OSAWA SHINICHI
SHINOHARA KEISUKE
ARAKI HISATOSHI
OSAWA SHINICHI
Application Number:
JP2017045010A
Publication Date:
September 20, 2018
Filing Date:
March 09, 2017
Export Citation:
Assignee:
DOWA METALTECH KK
International Classes:
C25D17/10; C25D5/02; C25D5/08; C25D21/10
Domestic Patent References:
| JP2016065282A | 2016-04-28 | |||
| JPH06256991A | 1994-09-13 | |||
| JP2014080652A | 2014-05-08 | |||
| JPH01168890A | 1989-07-04 | |||
| JPH07150396A | 1995-06-13 |
Attorney, Agent or Firm:
Koji Hagiwara
Tetsuo Kanamoto
Miaki Kametani
Takashi Saito
Tetsuo Kanamoto
Miaki Kametani
Takashi Saito