Title:
HIGH-ASPECT-RATIO STRUCTURE MANUFACTURING METHOD, ULTRASONIC PROBE MANUFACTURING METHOD, HIGH-ASPECT-RATIO STRUCTURE, AND X-RAY IMAGING APPARATUS
Document Type and Number:
Japanese Patent JP2018149015
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a high aspect-ratio structure manufacturing method allowing for further reduction of the occurrence of sticking, an ultrasonic probe manufacturing method and a high aspect-ratio structure, and an X-ray imaging apparatus.SOLUTION: A high aspect-ratio structure manufacturing method includes: a hole forming step of forming a plurality of holes in at least one main surface of a predetermined substrate 13, the holes extending in the direction intersecting the main surface; an area defining step of cyclically defining a plurality of first areas AR1 and second areas AR2 other than that on the main surface where the plurality of holes are formed; and a partly-leaving partition wall removing step of removing a plurality of partition walls between holes formed in the substrate 13 of the first area AR1 by immersing the substrate in the etching liquid so as to leave some partition walls except the bottom of each hole in a predetermined range along the direction intersecting the main surface. The hole forming step includes a partition wall-thinning hole forming step of forming a plurality of holes so that the partition wall thickness between the holes adjacent each other becomes thinner in the bottom side of the hole than at the main surface side.SELECTED DRAWING: Figure 7
Inventors:
YOKOYAMA HIKARI
YAMAMOTO YUKO
YAMAMOTO YUKO
Application Number:
JP2017046372A
Publication Date:
September 27, 2018
Filing Date:
March 10, 2017
Export Citation:
Assignee:
KONICA MINOLTA INC
International Classes:
A61B6/06; A61B6/00; A61B8/14; G01N23/20; H04R31/00
Attorney, Agent or Firm:
Etsushi Kotani
Masataka Otani
Satoshi Sakurai
Masataka Otani
Satoshi Sakurai