Title:
WIRING PREPARATION METHOD
Document Type and Number:
Japanese Patent JP2018152225
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a wiring preparation method capable of suppressing oxidation of a wire while preparing the wiring at low temperatures, easily and at low cost.SOLUTION: A wiring preparation method includes: a step of preparing; a step of coating; a step of forming a wiring 30; and a step of irradiating. In the step of preparing, an ink 10 and a base 20 are prepared. The ink 10 contains copper particles and a metal salt. In the step of coating, the ink 10 is coated on the base 20. After the ink 10 is coated, in the step of forming the wiring 30, the ink 10 is heated to form the wiring 30. In the step of irradiating, light L is irradiated on the wiring 30.SELECTED DRAWING: Figure 1
Inventors:
SUGANUMA KATSUAKI
LI WANLI
LI WANLI
Application Number:
JP2017047241A
Publication Date:
September 27, 2018
Filing Date:
March 13, 2017
Export Citation:
Assignee:
UNIV OSAKA
International Classes:
H01B13/00; B05D3/02; B05D3/06; B05D5/12; B05D7/24; B22F1/00; B22F1/02; B22F9/00; H01B1/00; H01B1/22; H01B5/14; H05K3/12
Attorney, Agent or Firm:
Hiroyuki Maei