Title:
SEMICONDUCTOR LIGHT-EMITTING DEVICE
Document Type and Number:
Japanese Patent JP2018160635
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting device in which both a base material and an encapsulation resin have a high heat resistance and a high light resistance, and that can achieve long lifetime and increase in output.SOLUTION: A semiconductor light-emitting device includes: a base material 2; an n-side wiring 3 and a p-side wiring 4 formed on the base material 2; a light-emitting element 7 arranged on the base material 2, and electrically connected with the n-side wiring 3 and the p-side wiring 4; and a transparent encapsulation resin 10 that encapsulates the light-emitting element 7. The base material contains an acrylic resin, and the encapsulation resin contains silicone.SELECTED DRAWING: Figure 1
Inventors:
KOBUCHI KEIYO
ITAI JUNICHI
ITAI JUNICHI
Application Number:
JP2017058285A
Publication Date:
October 11, 2018
Filing Date:
March 23, 2017
Export Citation:
Assignee:
ROHM CO LTD
International Classes:
H01L33/62; H01L23/12; H01L23/14; H01L23/29; H01L23/31; H01L33/56
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Attorney, Agent or Firm:
Patent Business Corporation Ai Patent Office