Title:
POWER SEMICONDUCTOR MODULE DEVICE
Document Type and Number:
Japanese Patent JP2018164359
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To improve cooling performance of a power semiconductor module device 1 constituting a three-phase inverter as well as reduce a temperature difference between arms.SOLUTION: A heat sink 3 is disposed on an undersurface of a semiconductor module 2 constituting a three-phase inverter. The heat sink 3 is partitioned into six refrigerant chambers 16a to 16f corresponding to respective six arms. By intersecting external piping, a refrigerant is configured to circulate in series in an order of a U-phase upper arm S1, a V-phase lower arm S4, a W-phase lower arm S6, a W-phase upper arm S5, a V-phase upper arm S3, and a U-phase lower arm S2. In a switching pattern as an inverter, difference in temperature of two arms becomes small that simultaneously perform ON actuation.SELECTED DRAWING: Figure 7
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Inventors:
SUZUKI SHOTA
Application Number:
JP2017060313A
Publication Date:
October 18, 2018
Filing Date:
March 27, 2017
Export Citation:
Assignee:
MEIDENSHA ELECTRIC MFG CO LTD
International Classes:
H02M7/48
Domestic Patent References:
| JP2011177004A | 2011-09-08 | |||
| JP2011018729A | 2011-01-27 | |||
| JP2016051878A | 2016-04-11 | |||
| JP2012064609A | 2012-03-29 |
Attorney, Agent or Firm:
Hiromichi Kobayashi
Tomioka Kiyoshi
Uzawa Hidehisa
Tomioka Kiyoshi
Uzawa Hidehisa